PRESS RELEASE – On the August 22, LG Innotek (CEO Moon, Hyuksoo) introduced that it’ll associate with Ansys, the world’s high engineering simulation firm, to develop the appliance of ‘Digital Twin’ know-how to all its processes.
‘Digital Twin’ is a know-how that replicates objects in a digital area to foretell the outcomes of attainable real-life conditions by means of laptop simulations. It’s heralded as a know-how able to fixing varied industrial and social issues. Particularly, it’s being quickly deployed within the manufacturing trade as it could scale back product improvement time and prices.
Ansys is thought to own world-leading know-how and deployment expertise within the subject of simulation utilizing 3D modeling, Synthetic Intelligence (AI), and Machine Studying (ML). By collaborating with Ansys, LG Innotek will have the ability to leverage its newest ‘Digital Twin’ options and simulation software program to construct a state-of-the-art ‘Digital Twin’ setting.
In collaboration with Ansys, LG Innotek carried out a trial utility of its ‘Digital Twin’ know-how to some improvement and manufacturing processes and has achieved tangible outcomes. Sooner or later, the corporate plans to develop the appliance of ‘Digital Twin’ to the event and manufacturing processes of its whole product vary, together with autonomous driving parts equivalent to car connectivity and sensing gadgets.
Preliminary verification of designs utilizing digital simulation, lowering improvement time by 99%
LG Innotek is reaping the advantages of its ‘Digital Twin’ in R&D. After verifying designs in a digital setting, the corporate makes use of the info to reduce the variety of checks that must be carried out and the time it takes to conduct them.
It utilized ‘Digital Twin’ know-how to the event of package deal substrate (PS) merchandise for semiconductors, managing to scale back the event time by 99%.
Substrates require the minimization of ‘Warpage’ as a result of warmth and strain to which they’re uncovered throughout manufacturing. That is achieved by means of a simulation course of that optimizes the mixture of the circuit design construction and supplies composition ratio. Utilizing digital simulation by means of 3D modeling, LG Innotek has lowered the time required to foretell the diploma of ‘Warpage’ of a single substrate from 11 days to three.6 hours.
Rising deployment of ‘Digital Twin’ to FC-BGA and digital part manufacturing processes, maximizing manufacturing competitiveness
LG Innotek has expanded the appliance of ‘Digital Twin’ know-how to not solely product improvement but additionally the FC-BGA (Flip-Chip Ball-Grid Array) manufacturing course of. Utilizing this know-how, the corporate has succeeded in halving the ramp-up interval (enhance in manufacturing capability by enhancing yield within the early phases of mass manufacturing) by establishing optimum circumstances for the FC-BGA manufacturing tools.
Prior to now, the corporate needed to conduct tons of of checks to establish the optimum FC-BGA course of circumstances, which relied closely on money and time. Utilizing 3D modeling, it has replicated the FC-BGA manufacturing course of in a digital area.
Operating the method in a digital area allows the pc to visualise and establish issues that might happen with varied course of tools. This makes it attainable to meticulously optimize circumstances, such because the movement of liquids, warmth, and air that can not be measured inside such tools.
As well as, LG Innotek has managed to extend productiveness by actively utilizing ‘Digital Twin’ within the manufacturing technique of digital car parts. Since digital car parts have an extended product lifespan and are extremely weak to the climate, guaranteeing high quality and reliability is essential.
LG Innotek utilized ‘Digital Twin’ know-how to the soldering course of, which is a key course of for guaranteeing the reliability of digital car parts. The soldering course of was simulated in a digital area to foretell the time it takes for the solder to crack. By optimizing course of circumstances equivalent to the quantity of solder utilized and nozzle design to delay cracking as a lot as attainable, the corporate plans to extend productiveness by 40% in comparison with the earlier course of.
“LG Innotek to turn into a ‘meta-manufacturing’ firm by advancing Digital Twin know-how”
By its partnership with Ansys, LG Innotek plans to quickly develop the usage of ‘Digital Twin’ know-how to all product traces and processes, together with new progress companies equivalent to car communication modules and LiDAR (gentle detection and ranging) gadgets.
Sooner or later, the corporate plans to develop the usage of ‘Digital Twin’ know-how to clients and companions throughout the complete worth chain, from improvement to manufacturing. In consequence, companions and clients will have the ability to collaborate on product design and simulate the effectivity of manufacturing processes on the digital ‘Digital Twin’ platform constructed by LG Innotek.
The entire information generated within the digital area might be collected in actual time and used to enhance product design and buyer processes. All information from LG Innotek, its companions, and clients might be organically related and shared in actual time, enabling systematic high quality management and environment friendly improvement.
Moreover, AI might be utilized to the digital design and high quality course of verification to extend simulation pace and accuracy. AI will be taught from the info collected by means of simulation to derive optimum options and assist decision-making by engineers. LG Innotek believes the productiveness positive factors might be multiplied by combining the strengths of virtualization and AI know-how.
LG Innotek Chief Expertise Officer S.David Roh mentioned, “The longer term we envision at LG Innotek is meta-manufacturing, the place simulation outcomes from a digital area are linked to bodily manufacturing services and routinely result in precise manufacturing.” He added, “To this finish, we are going to quickly apply superior ‘Digital Twin’ know-how to the complete worth chain, together with R&D, manufacturing, and high quality management, to create differentiated buyer worth.”
